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DFLS130L
Document number: DS30492 Rev. 4 - 2
1 of 4
www.diodes.com
June 2009
? Diodes Incorporated
DFLS130L
PowerDI is a registered trademark of Diodes Incorporated.
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER ?
123
PowerDI
Features
?
Guard Ring Die Constructi
on for Transient Protection
?
Low Power Loss, High Efficiency
?
Patented Interlocking Clip Design for High Surge Current
Capacity
?
High Current Capability and Low Forward Voltage Drop
?
Lead Free Finish, RoHS Compliant (Note 4)
?
"Green" Molding Compound (No Br, Sb)
?
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
?
Case: PowerDI
?123
?
Case Material: Molded Plastic,
“Green” Molding Compound.
UL Flammability Classification Rating 94V-0
?
Moisture Sensitivity: Level 1 per J-STD-020D
?
Terminal Connections: Cathode Band
?
Terminals: Finish – Matte Tin ann
ealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
?
Marking Information: See Page 2
?
Ordering Information: See Page 2
?
Weight: 0.01 grams (approximate)
Maximum Ratings
@TA
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
30
V
RMS Reverse Voltage
VR(RMS)
21
V
Average Forward Current @ TT
= 121°C
IF(AV)
1.0
A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
IFSM
50
A
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 1)
PD
1.67 W
Power Dissipation (Note 2)
PD
556
mW
Thermal Resistance Junction to Ambient (Note 1)
RθJA
60
°C/W
Thermal Resistance Junction to Ambient (Note 2)
RθJA
180 °C/W
Thermal Resistance Junction to Soldering (Note 3)
RθJS
10 °C/W
Operating Temperature Range
TJ
-40 to +125
°C
Storage Temperature Range
TSTG
-40 to +150
°C
Electrical Characteristics
@TA
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 5)
V(BR)R
30
?
?
V
IR
= 1.0mA
Forward Voltage
VF
?
?
?
0.210
0.310
0.328
?
?
0.36
V
IF
= 0.1A
IF
= 1.0A
IF
= 1.5A
Leakage Current (Note 5)
IR
?
?
0.260
?
?
1.0
mA
VR
= 5V, T
A
= 25
°C
VR
= 30V, T
A
= 25
°C
Total Capacitance
CT
?
76
?
pF
VR
= 10V, f = 1.0MHz
Notes: 1. Part mounted on 2"x2" GETEK board with 1"x1" copper pad, 25% anode, 75% cathode. TA
= 25°C.
2. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Theoretical RθJS
calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
4. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied. Please visit our website at http://www.diodes.com/products/lead_free.html.
5. Short duration pulse test used to minimize self-heating effect.
Top View
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